Registration
We are pleased to invite you to WaferBond'25 & we look forward to your participation!
We are happy to offer you the option of an early bird ticket. Secure your Earlybird ticket and benefit from a discount on the conference fee. The early bird ticket option is available up to August 31, 2025.
Conference fees
Early-Bird Fee: 452,20€ (380,00€ + 19% Tax) per Person
Regular fee: 571,20€ (480,00€ + 19% Tax) per Person
Registration fee contains:
Conference Participation
Experience the entire conference with access to all presentations, poster sessions and exhibition areas from companies that are active in this field . The price also includes the Book of Abstracts, access to the available presentations as well as lunch, drinks and snacks.
Welcome Reception
Start the conference with us and enjoy the Welcome Dinner on 2nd December from 5 to 9 pm at Fraunhofer ENAS. As part of the evening, we offer you an evening snack and the opportunity to visit the cleanroom facilities and wafer bonding laboratories. A perfect start for discussions and initial networking.
Conference Dinner
Enjoy a conference dinner on 3rd December from 6 to 10 pm in the ambience of the smac Museum. In addition to dinner, you will have the opportunity to take part in an museum tour and socialise with other participants in a relaxed atmosphere. If you wish, you can bring your partner along for an extra charge of 70€.